Hongjing Electronics (Shenzhen) Co., Ltd
Porque é que a soldadura de placas PCB continua a ser fundamental

While SMT dominates consumer electronics, DIP soldering techniques prove essential for:
- Military hardware (92% mission-critical systems use DIP)
- High-voltage power delivery solutions
- Prototyping requiring manual adjustments
Comparative performance metrics:
Parameter | DIP | SMD |
---|---|---|
Vibration Resistance | +32% | Baseline |
Thermal Stability | +28% | Baseline |
Essential Tools for Professional PCB Board Soldering
Equipment | Key Specifications | Usage Tips |
---|---|---|
Temperature-controlled Iron | 60W, 200-480°C range | Maintain 350°C±15°C for lead-free alloys |
Lead-free Solder Wire | Sn99Ag0.3Cu0.7, 0.8mm dia | Apply 3-4mm per joint |
Flux Pen | RMA-223 certification | Pre-apply to component leads |
9-Step DIP Soldering Protocol
1. Board Preparation
- Clean with 99% isopropyl alcohol
- Secure PCB in ESD-safe vise
2. Component Insertion
- Bend leads at 45° angle
- Ensure full seating against board
Pro Tip: For radial components:
- Insert at 3 o’clock position
- Rotate counterclockwise to 9 o’clock
3. Thermal Preheating
- Set board preheater to 90-110°C
- Critical for:
- Thick copper boards (>3oz)
- Multilayer RF PCBs
4. Soldering Iron Preparation
- Clean tip with brass wool
- Apply thin solder coating
5. Heat Application
- Contact pad+lead junction for 2-3 seconds
6. Solder Feeding
- Feed wire to opposite side of tip
- Allow molten flow to form concave fillet
Avoid: Direct solder-to-tip contact → cold joints
7. Joint Completion
- Remove iron first
- Let solidify naturally
8. Lead Trimming
- Cut within 1.5mm of board surface
9. Final Cleaning
- Remove flux residues with ethanol
- Inspect under 10x magnification
Advanced Techniques for Complex PCB Boards
1. High-Density Assembly
- Implement staggered heating patterns
- Use thermal relief pads
2. Lead-Free Challenges
- Increase tip temperature by 30-50°C
- Consider nitrogen atmosphere systems
Explore automated solutions →
Global Industry Developments
- Miniaturization: <0.5mm pitch components
- AI Inspection: 99.3% defect detection accuracy
- Lead-free Mandates: 86% markets adopted