Hongjing Electronics (Shenzhen) Co., Ltd
PCB (Printed Circuit Board) is a substrate made of insulating materials (such as FR-4), with conductive copper layers formed on its surface through printing or etching processes to create circuit patterns. Electronic components are fixed onto the PCB by soldering and…
SMT (Surface Mount Technology) is an advanced manufacturing process that directly mounts electronic components onto the surface of a printed circuit board (PCB). Compared to traditional through-hole technology (THT), SMT offers higher production efficiency, smaller component sizes, and better electrical…
DIP (Dual In-line Package) is a traditional form of electronic component packaging where the pins are inserted through holes in a printed circuit board (PCB) and soldered in place. DIP production is widely used in applications requiring high reliability and…
FPC (Flexible Printed Circuit) is a bendable circuit board made of flexible insulating materials (such as polyimide PI or polyester PET), widely used in modern electronic devices, especially in applications requiring lightweight, high-density wiring, or dynamic bending. 1. Core Features…
