6-Layer PCB Manufacturing | TG170 2.0mm Board | ENIG 2U” RoHS | SMT+DIP PCBA | PCB Assembly | 2oz Copper Thickness

6-Layer PCB Manufacturing | TG170 2.0mm Board | ENIG 2U” RoHS | SMT+DIP PCBA | PCB Assembly | 2oz Copper Thickness

Place of Origin: Shenzhen, China

Brand Name: HJ-PCBA

Model Number: HJ-PCBA-30286

MOQ: 1 pc

Payment Terms: Paypal / , T/T

Supply Ability: 15000-25000square meters per month

6-Layer PCB Manufacturing | TG170 2.0mm Board | ENIG 2U” RoHS | SMT+DIP PCBA | PCB Assembly | 2oZ Copper Thickness

Detailed Specifications

MaterialTG170
Board Thickness2.0mm
Surface TreatmentENIG
Copper Thickness2/1/1/1/1/2 oz
SoldermaskGreen
SilkscreenWhite
The Min Laser Drill Hole6Mill
PanelMouse Bite

Product Description

1.PCB Assembly Services Overview

Product : Multilayer Printed Circuit Board (Multilayer PCB) designed for security equipment applications.
Order Flexibility : Prototype, small, medium, and large-volume production supported. No MOQ required for new orders.
Certifications : Full compliance with UL, IATF 16949 (automotive), RoHS, ISO 9001, and other industry standards.

2.Specification Of PCB Assembly Service
CATEGORY PARAMETER SPECIFICATIONSTECHNICAL NOTES
SubstrateLayers1-20 LayersComplies with IPC-4101 Class 2 standards
MaterialFR-4,CEM-1/3 ,High Tg (>170°C),
Halogen-Free FR4,FR-1/2,
Aluminum Core PCB
Thermal Conductivity of Aluminum Core PCB ≥2.0 W/(m·K)
Board Thickness0.2mm-7mmTolerance: ±10%
FabricationMax. Board Size500mmx500mmSupports Panelization
Min. Drill Hole Size0.25mmMechanical Drilling

(Minimum drill bit size: 0.25mm)

Min. Line Width/spacing0.075mm(3mil)Supports High Density Interconnect (HDI)
Surface FinishSurface FinishHASL(Lead-Free HASL), Chemical Tin,

ENIG, lmmAg,OSP, Gold Plating

ENIG (Electroless Nickel Immersion Gold):

Nickel thickness 3-5μm,

Gold thickness 0.05-0.1μm (per IPC-4552)

Solder Mask ColorGreen/Black/white/Red/Blue/YellowMatte/Gloss Finish available
Copper Thickness0.5-4oz (17-140um)Outer layer copper thickness ≥1 oz (35μm)
TolerancePTH Hole Tolerance±0.076mmComplies with IPC-6012 Class 2
NPTH Hole Tolerance±0.05mm
PackingInner PackingVacuum Sealing + ESD BagMoisture Sensitive Devices (MSDs) controlled per MSD Level 3 (IPC/JEDEC J-STD-033)
OuterPackingStandard Cartonptional anti-shock padding or custom wooden crate
CertificationsCertificatesUL,ISO9001.IS014001. ROHS.CQCSupports lead-free process (IPC J-STD-001)
ProfilingProfiling MethodRouting、V-CUT、Beveling V-CUT depth controlled to ±0.1 mm

(when board thickness is 1.6 mm)

AssemblyAssembly Serviceull-range PCBA OEM/ODM ServicesSMT placement accuracy ±0.025 mm (Cpk ≥1.33),

DIP insertion yield ≥99.95%; Support for ICT/FCT testin

 

3.PCB Assembly(SMT) Product Capacity
CAPABILITY CATEGORYTECHNICAL SPECIFICATIONS
SMT CapacityMax. PCB Size: 510mm x1200mm(SMT Process)
Supported Components: 0201.0402.0603.0805.1206
Packages
Min. lC Pin Pitch: 0.1mm
Min. BGA Pitch: 0.1mm
IC Placement Accuracy
+0.01mm(CPK=1.67)
Daily Capacity: ≥8 MillionPoints/Day (Dual Shifts)
DIP Capacity3 Full-Automatic DlP Lines(Wave Soldering/SelectiveSoldering)
Testing ServicesStandard Tests.Bridgeest
.AOl Inspection
.X-Ray Analysis
.FlyingProbe
Functional Tests.In-CircuitTest (lCT)
.Functional Test(FCT)
.Thermal Cycling
Reliability Tests.DropImpact (lEC 60068-2-32)
.Burn-In (72H@85°C/85%RH)
Custom Tests.WaterproofTest(lP67/P68)
.LeakageCurrent Test (s0.1mA)

 

4.Products Application:

1. Telecom & Communication
2. Consumer Electronics
3. Security & Surveillance
4. Automotive Electronics
5. Smart Home & IoT
6. Industrial Control & Automation
7. Medical Devices
8. Military & Defense
9. New Energy Systems
10. Renewable Energy & Power

 

5.OEM/ODM/EMS Services for PCBA
1. Design
Integrated PCBA & Enclosure Design
▪ DFM-optimized PCB layout (supports rigid-flex, HDI)
Rapid Prototyping
▪ Rapid PCB/PCBA prototyping (SMT+PTH+BGA mixed assembly)
2. Advanced Manufacturing
PCB Assembly
▪ High-precision SMT (Supported Components: 0201.0402.0603.0805.1206, 0.1mm pitch BGA)
▪ Dual-line PTH assembly with selective wave soldering
Structural Fabrication
▪ Plastic injection molding (ABS/PC/PMMA, ±0.15mm tolerance)
▪ Precision sheet metal stamping (aluminum/steel, CNC deburring)
3. Supply Chain Management
Component Procurement
▪ Procurement of Component BOM List
4. Testing & Validation
Automated Quality Control
AOI、 Online testing (ICT), functional testing (FCT)
5. Logistics & Compliance
Global Trade Services
▪ HS code classification & customs clearance optimization

 

6.FAQ
Q1: Are you a factory or a trading company?
A: We are a direct electronics manufacturer based in Shenzhen, China, with full in-house production capabilities.
Q2: Do you accept sample orders?
A: Yes, we accept sample orders for product verification. Customized prototyping and functional testing are available upon request.
Q3: What is your warranty policy?
A: We offer a 24-month warranty covering defects caused by non-human factors (e.g., manufacturing or material flaws). Replacement or repair services will be provided upon validation.
Q4: What payment terms do you accept?
A: We accept 100% T/T (Telegraphic Transfer) for all orders. Other payment methods can be negotiated for long-term partnerships.
Q5: What is the lead time for bulk orders?
A: Standard lead time ranges from 20 to 35 working days , depending on order complexity and quantity. Expedited production options are available for urgent projects.

If you have PCB design, prototyping, or mass production needs, feel free to share your Gerber files,BOM lists or technical specifications, 
and we will provide the optimal solution!
📞 Contact Us:
- Email: [hjpcbassemblysmt@gmail.com] 
- Phone: [18929375891]

Looking forward to collaborating with you! 🚀

Place of Origin

Shenzhen, China

Brand Name

HJ-PCBA

Model Number

HJ-PCBA-30286

MOQ

1 pc

Payment Terms

Paypal / , T/T

Supply Ability

15000-25000square meters per month

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